HGC Workshop Feb 2025
https://indico.cern.ch/event/1464337/
Intro slides Karl
Expect v3d to be usable everywhere in the system, with SEE to TOA to be managed as a feature • Transition to module assembly with v3d once validated (by summer) v3e with SEE resistant TOA IP block, design in work • Would like to complete the detector with this chip once qualified, and this will be only in 12m (if things go smoothly!)
Modules Meeting at HGCal Week
Production plan - module types and distribution of components
Proposal to have ROC 3C hexaboards available at MACs in March
- April: 4/day x 2 weeks
- May 8/day x 2 weeks
- June 12/day
- July 16/day
ROC 3B − Build with non-production (prototype) sensor
Engineering Report
- Last tools fo CMU and TTU delivered ~now to UCSB
Follow-ups
Links:
202502241446